Description: Semiconductor Packaging : Materials Interaction and Reliability, Paperback by Chen, Andrea; Lo, Randy Hsiao-yu, ISBN 113807540X, ISBN-13 9781138075405, Like New Used, Free shipping in the US This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
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Book Title: Semiconductor Packaging : Materials Interaction and Reliability
Number of Pages: 216 Pages
Publication Name: Semiconductor Packaging : Materials Interaction and Reliability
Language: English
Publisher: CRC Press LLC
Publication Year: 2017
Subject: Industrial Design / Packaging, Electronics / Semiconductors, Electronics / Microelectronics, Electronics / Circuits / General, Electronics / General
Type: Textbook
Item Weight: 16 Oz
Item Length: 9.2 in
Subject Area: Technology & Engineering
Author: Randy Hsiao-Yu Lo, Andrea Chen
Item Width: 6.1 in
Format: Trade Paperback
